{"product_id":"thermal-conductivity-tester-heat-flow-meter","title":"Thermal Conductivity Tester – Heat Flow Meter","description":"\u003ch2\u003e\u003cspan\u003eThermal Conductivity Tester (TPS Method) – High-Precision Heat Flow Meter QualiHFM™-1000\u003c\/span\u003e\u003c\/h2\u003e\n\u003cp\u003e\u003cspan\u003eThe QualiHFM™-1000 Thermal Conductivity Tester uses the Transient Plane Source (TPS) method to measure thermal properties quickly and accurately. Designed for versatile material analysis, this instrument is well suited to research and development laboratories and quality control facilities that evaluate materials ranging from bulk solids to liquids and pastes.\u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan\u003eCompliant with ISO 22007-2:2008, the tester addresses common measurement errors associated with static testing techniques. It provides direct measurements of thermal conductivity, thermal diffusivity, and specific heat capacity across a wide range of material types.\u003c\/span\u003e\u003c\/p\u003e\n\u003ch2\u003e\u003cspan\u003eVersatile Material Compatibility\u003c\/span\u003e\u003c\/h2\u003e\n\u003cp\u003e\u003cspan\u003eThe QualiHFM™-1000 accommodates diverse material forms and compositions, including:\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eSolids:\u003c\/span\u003e\u003cspan\u003e Bulk insulation, polymers, metals, and ceramics.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eFluids:\u003c\/span\u003e\u003cspan\u003e Liquids, pastes, and colloids.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eComplex Structures:\u003c\/span\u003e\u003cspan\u003e Granular materials, powders, coatings, and thin films.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003e\u003cspan\u003eFeatures and Advantages\u003c\/span\u003e\u003c\/h2\u003e\n\u003ch3\u003e\u003cspan\u003eEfficient and Fast Testing\u003c\/span\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eRapid Measurement:\u003c\/span\u003e\u003cspan\u003e Adjustable testing durations from 5 to 160 seconds support high-throughput material evaluation while maintaining measurement accuracy.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eDirect Property Measurement:\u003c\/span\u003e\u003cspan\u003e Determines thermal properties directly without requiring complex calibration curves.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003e\u003cspan\u003eHigh Measurement Accuracy\u003c\/span\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eISO Standard Compliance:\u003c\/span\u003e\u003cspan\u003e Follows ISO 22007-2:2008 requirements to support consistent measurements and international quality assurance.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eAdvanced Data Processing:\u003c\/span\u003e\u003cspan\u003e An ARM microprocessor and high-resolution data acquisition chips enable faster analysis and greater precision than conventional thermal analyzers.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eReduced Contact Resistance Errors:\u003c\/span\u003e\u003cspan\u003e The transient measurement technique minimizes errors associated with thermal contact resistance, a common limitation of static heat flow meters.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003e\u003cspan\u003eUser-Friendly Operation\u003c\/span\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eMinimal Sample Preparation:\u003c\/span\u003e\u003cspan\u003e No complex machining is necessary. Bulk solid samples require only a relatively smooth surface measuring at least twice the probe diameter.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eIntuitive Touchscreen Interface:\u003c\/span\u003e\u003cspan\u003e A large color LCD touchscreen simplifies instrument operation and displays measurement data in real time.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eAutomated Data Management and Reporting:\u003c\/span\u003e\u003cspan\u003e Integrated software supports automated PC communication, data management, and immediate report generation.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003e\u003cspan\u003eTransient Plane Source (TPS) Method: Operating Mechanism and Measurement Principles\u003c\/span\u003e\u003c\/h2\u003e\n\u003cp\u003e\u003cspan\u003eThe QualiHFM™-1000 uses a controlled heating pulse and real-time resistance monitoring to determine material thermal properties. The measurement sequence follows these stages:\u003c\/span\u003e\u003c\/p\u003e\n\u003cpre class=\"mermaid\"\u003eflowchart LR\n    A[QualiHFM-1000 double-helix probe sandwiched between sample halves] --\u0026gt; B[Adjustable 5-to-160-second controlled electrical heat pulse]\n    B --\u0026gt; C[Real-Time Resistance Logging via ARM Microprocessor \u0026amp; High-Res Chips]\n    C --\u0026gt; D[Convert Resistance Shifts into Temperature Response]\n    D --\u0026gt; E[Map Temperature Climbs Against ISO 22007-2:2008 Math Models]\n    E --\u0026gt; F[Direct Calculation of Thermal Conductivity, Diffusivity \u0026amp; Heat Capacity]\u003c\/pre\u003e\n\u003ch3\u003e\u003cspan\u003eStep-by-Step Measurement Process\u003c\/span\u003e\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003ePlanar Probe Placement:\u003c\/span\u003e\u003cspan\u003e A flat, double-helix probe is positioned between two matching sections of the sample. This arrangement supports rapid testing without the extended waiting periods associated with static measurement techniques.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eControlled Joule Heating:\u003c\/span\u003e\u003cspan\u003e An adjustable electrical current heats the double-helix probe for 5 to 160 seconds, generating a transient heat wave that propagates into the surrounding material.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eHigh-Resolution Resistance Monitoring:\u003c\/span\u003e\u003cspan\u003e As heat moves into the sample layers, high-resolution data acquisition chips record changes in the probe's electrical resistance at high frequencies.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eARM Microprocessor Analysis:\u003c\/span\u003e\u003cspan\u003e The ARM microprocessor converts resistance variations into temperature responses based on the probe's known thermal response characteristics.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eDimensionless Curve Fitting:\u003c\/span\u003e\u003cspan\u003e The measured temperature response is compared with mathematical time-dependent models that comply with ISO 22007-2:2008.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eDirect Calculation of Multiple Properties:\u003c\/span\u003e\u003cspan\u003e The system determines thermal conductivity, thermal diffusivity, and specific heat capacity directly, without complex calibration curves or destructive sample heating.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003ch2\u003e\u003cspan\u003eSensor Physics and Theoretical Assumptions\u003c\/span\u003e\u003c\/h2\u003e\n\u003cp\u003e\u003cspan\u003eThe QualiHFM™-1000 uses dynamic heat transfer equations in which a single thermoresistive element functions as both the heat source and the temperature sensor.\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eDouble-Helix Probe Assembly:\u003c\/span\u003e\u003cspan\u003e The planar sensor contains a conductive nickel double-spiral pattern enclosed within thin insulating film layers. This configuration distributes heat radially and uniformly into the two surrounding sample sections.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eGoverning Mathematical Model:\u003c\/span\u003e\u003cspan\u003e The average temperature rise (ΔT)\u003c\/span\u003e\u003cspan\u003e of the planar sensor is directly related to the dimensionless time function D(τ)\u003c\/span\u003e\u003cspan\u003e:\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cdiv\u003e\n\u003cspan\u003eΔT(τ) = (I\u003c\/span\u003e\u003csup\u003e2\u003c\/sup\u003e\u003cspan\u003e · R\u003c\/span\u003e\u003csub\u003e0\u003c\/sub\u003e\u003cspan\u003e · α\u003c\/span\u003e\u003csub\u003eR\u003c\/sub\u003e\u003cspan\u003e) \/ (π\u003c\/span\u003e\u003csup\u003e3\/2\u003c\/sup\u003e\u003cspan\u003e · r · k) · D(τ)\u003c\/span\u003e\n\u003c\/div\u003e\n\u003cp\u003e\u003cspan\u003e Where: Where \u003cem\u003eI\u003c\/em\u003e is electrical current, \u003cem\u003eR\u003csub\u003e0\u003c\/sub\u003e\u003c\/em\u003e is initial probe resistance, \u003cem\u003eα\u003csub\u003eR\u003c\/sub\u003e\u003c\/em\u003e is the temperature coefficient of resistance, \u003cem\u003er\u003c\/em\u003e is sensor radius, \u003cem\u003ek\u003c\/em\u003e is thermal conductivity, and \u003cem\u003eD(τ)\u003c\/em\u003e is the time-dependent theoretical function.\u003c\/span\u003e\u003c\/p\u003e\n\u003ch3\u003e\u003cspan\u003eIdealized Boundary Assumptions\u003c\/span\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eSemi-Infinite Sample Boundaries:\u003c\/span\u003e\u003cspan\u003e The sample layers are sufficiently thick, measuring at least twice the probe diameter, to prevent heat from reaching the outer boundaries during the measurement period.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eNegligible Sensor Thermal Mass:\u003c\/span\u003e\u003cspan\u003e The planar probe is sufficiently thin that its own heat capacity can be treated as negligible.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eNegligible Contact Resistance:\u003c\/span\u003e\u003cspan\u003e Dynamic transient calculations minimize thermal contact resistance errors that commonly affect static heat flow measurements.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eControlled Step-Function Heating:\u003c\/span\u003e\u003cspan\u003e The input heating power is modeled as an instantaneous, precisely controlled step function.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTechnical Specifications (QualiHFM™-1000 TPS System)\u003c\/h2\u003e\n\u003ctable class=\"table table-style-align-center\" align=\"center\" border=\"1\" cellpadding=\"8\" cellspacing=\"0\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eTesting Parameter\u003c\/th\u003e\n\u003cth\u003eQualiHFM™-1000 Hardware Specifications\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eProduct Model\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eThermal Conductivity Tester (TPS Method): QualiHFM™-1000\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eCore Measurement Method\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eTransient Plane Source (TPS) Method\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eInternational Standard\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eISO 22007-2:2008 (Plastics: Transient plane heat source method)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eProcessing Hardware\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eARM Microprocessor with High-Resolution Data Processing Chips\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eUser Interface\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eLarge Color LCD Touchscreen Display with Automated PC Reporting Software\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eMeasured Properties\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eThermal Conductivity, Thermal Diffusivity, and Specific Heat Capacity\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eTest Duration\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eAdjustable between 5 seconds and 160 seconds\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eSample Preparation\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eMinimal prep (requires relatively smooth surface at least twice probe diameter)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eDirect Calculation\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eDirect measurement output without needing complex calibration curves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003e\u003cspan\u003ePractical Error Corrections and System Advantages\u003c\/span\u003e\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eThermal Contact Resistance Compensation:\u003c\/span\u003e\u003cspan\u003e Static heat flow meters can produce errors because of thermal resistance at the interface between sample surfaces and test plates. The QualiHFM™-1000 uses transient mathematical models to isolate contact resistance effects and obtain accurate measurements without extensive sample machining.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eReal-Time Electrical Power Monitoring:\u003c\/span\u003e\u003cspan\u003e The resistance of the heating wire changes as its temperature increases. Continuous voltage monitoring helps regulate energy delivery and prevent systematic calculation errors.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eInsulation Thermal Mass Compensation:\u003c\/span\u003e\u003cspan\u003e The thin protective casing surrounding the double-spiral wire absorbs a portion of the initial heat. Time-zero software adjustments subtract these insulation-related effects before the final material properties are calculated.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eAutomated Measurement Window Selection:\u003c\/span\u003e\u003cspan\u003e Integrated algorithms compliant with ISO 22007-2:2008 evaluate data collected between 60% and 80% of the total heating period. This process reduces operator bias and decreases measurement variation by nearly 60%.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003e\u003cspan\u003eVersatile Material Compatibility and Testing Capabilities\u003c\/span\u003e\u003c\/h2\u003e\n\u003cp\u003e\u003cspan\u003eThe \u003c\/span\u003e\u003cspan\u003eQualiHFM™-1000 Thermal Conductivity Tester\u003c\/span\u003e\u003cspan\u003e supports thermal property measurements across a broad range of material states and structural compositions.\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eSolids and Bulk Samples:\u003c\/span\u003e\u003cspan\u003e Evaluates bulk insulation blocks, dense polymers, ceramics, and structural metals with minimal preparation. Samples need only a relatively flat surface measuring at least twice the probe diameter.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eFluids and Pastes:\u003c\/span\u003e\u003cspan\u003e Measures liquids, pastes, and colloidal suspensions directly without requiring specialized calibration curves.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003ePowders and Thin Films:\u003c\/span\u003e\u003cspan\u003e Supports testing of loose granular materials, fine powders, industrial coatings, and thin films.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cspan\u003eAnisotropic Composites:\u003c\/span\u003e\u003cspan\u003e For fiber-reinforced composites and graphite sheets with direction-dependent thermal conductivity, the TPS method can determine both through-plane and in-plane thermal properties in a single test run when the heat capacity is known.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eThermal Conductivity Tester – Heat Flow Meter QualiHFM™-1000 Technical Specifications\u003c\/h2\u003e\n\u003cmain class=\"container\"\u003e\n\u003csection class=\"content-section\"\u003e\n\u003cdiv class=\"specs-table-container\"\u003e\n\u003ctable class=\"table table-style-align-center\" align=\"center\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003cth\u003eModel\u003c\/th\u003e\n\u003ctd\u003eQualiHFM™-1000\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eMeasurement Method\u003c\/th\u003e\n\u003ctd\u003eTransient Plane Source (TPS)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eThermal Conductivity Range\u003c\/th\u003e\n\u003ctd\u003e0.0001 - 300 W\/(m·K)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eMeasurement Accuracy\u003c\/th\u003e\n\u003ctd\u003e±3%\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eRepeatability Error\u003c\/th\u003e\n\u003ctd\u003e≤3%\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eMeasurement Time\u003c\/th\u003e\n\u003ctd\u003e5 - 160 seconds (Adjustable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eSample Temperature Range\u003c\/th\u003e\n\u003ctd\u003e-20°C to 320°C\u003cbr\u003e\u003cem\u003e\u003csmall\u003e(Requires external temperature control equipment)\u003c\/small\u003e\u003c\/em\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eSample Temperature Rise\u003c\/th\u003e\n\u003ctd\u003e\u0026lt; 15°C during test\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eProbe Diameters\u003c\/th\u003e\n\u003ctd\u003e\n\u003cstrong\u003eProbe 1:\u003c\/strong\u003e 7.5 mm\u003cbr\u003e\u003cstrong\u003eProbe 2:\u003c\/strong\u003e 15 mm\u003cbr\u003e\u003cstrong\u003eProbe 3:\u003c\/strong\u003e 30 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eRequired Sample Dimensions\u003cbr\u003e\u003csmall\u003e(Single Sample Size)\u003c\/small\u003e\n\u003c\/th\u003e\n\u003ctd\u003e\n\u003cstrong\u003eFor Probe 1:\u003c\/strong\u003e ≥ 15 × 15 × 3.75 mm\u003cbr\u003e\u003cstrong\u003eFor Probe 2:\u003c\/strong\u003e ≥ 30 × 30 × 7.5 mm\u003cbr\u003e\u003cstrong\u003eFor Probe 3:\u003c\/strong\u003e ≥ 60 × 60 × 20 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eProbe Power Output\u003c\/th\u003e\n\u003ctd\u003e\n\u003cstrong\u003eProbe 1:\u003c\/strong\u003e 0 \u0026lt; P \u0026lt; 1 W\u003cbr\u003e\u003cstrong\u003eProbe 2:\u003c\/strong\u003e 0 \u0026lt; P \u0026lt; 14 W\u003cbr\u003e\u003cstrong\u003eProbe 3:\u003c\/strong\u003e 0 \u0026lt; P \u0026lt; 14 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003ePower Supply\u003c\/th\u003e\n\u003ctd\u003eAC 220V (110V option available), \u0026lt; 500W Power Consumption\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003cth\u003eControl System\u003c\/th\u003e\n\u003ctd\u003eARM Microprocessor with High-Resolution Data Chip\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003c\/main\u003e","brand":"Qualitest USA LC","offers":[{"title":"Default Title","offer_id":53493921448247,"sku":null,"price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0786\/1859\/1543\/files\/thermal-conductivity-tester-heat.webp?v=1793685630","url":"https:\/\/qualitest.us\/fr\/products\/thermal-conductivity-tester-heat-flow-meter","provider":"Qualitest USA LC","version":"1.0","type":"link"}